Curable compositions based on epoxy resins

USRE32628E · kind E · reissue

Assignee

• BASF SE

Inventors

• Helmut Tesch · Bad Dürkheim, DE
• Manfred Heym · Bad Dürkheim, DE
• Walter Doerflinger · Espelkamp, DE
• Herbert Stutz · Karlsruhe, DE
• Peter Neumann · Wiesloch, DE
• Dietmar Nissen · Heidelberg, DE
• Gerhard Schaefer · Heidelberg, DE

Key dates

• Filing date: Nov 24, 1986
• Grant date: Mar 22, 1988
• Expiry date: Nov 24, 2006

Classification

• Technology area (CPC —): General

Abstract

A solvent-free curable composition has a long shelf life and consists of PA0 A 100 parts by weight of an epoxy resin and PA0 B from 10 to 100 parts by weight of .[.,.]. .Iadd.4,4-bis-(para-aminobenzoyl)-piperazine .Iaddend.as a curing agent for the epoxy resin, .[.an aromatic diamine containing ##STR1## groups,.]. with or without C from 0.01 to 5 parts by weight of an accelerator, the curing agent for the epoxy resin being finely dispersed in the latter and preferably having a particle size of less than 10 .mu.m. .[.The preferred epoxy resin curing agent is 4,4'-diaminodiphenyl ketone..]. The curable composition is used in particular for the preparation of fiber-reinforced materials.