Thermosetting epoxy resin compositions
USRE32958E · kind E · reissue
0Cited by
8References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 1987 |
| Grant date | Jun 20, 1989 |
| Priority date | — |
| Expiry date | Sep 14, 2007 |
Classification
- Technology area (CPC —)General
Abstract
What is disclosed are thermosetting epoxy resin compositions containing block siloxane copolymers which are used to induce low internal stress in the cured compositions and to provide coefficients of thermal expansion more closely aligned with the coefficients of thermal expansion of the substrates being molded therewith.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.