Method for preparing a printed circuit board
USRE33108E · kind E · reissue
1Cited by
3References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 16, 1988 |
| Grant date | Nov 7, 1989 |
| Priority date | — |
| Expiry date | Nov 16, 2008 |
Classification
- Technology area (CPC —)General
Abstract
The invention provides a method for preparing a printed circuit board with plated-through-holes, using a specifically prepared photoresist material and a combination of exposure, development and etching means. This method is particularly useful for the preparation of a printed circuit board with plated-through-holes bearing a high density circuit pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.