Method for electroplating nickel onto titanium alloys
USRE33800E · kind E · reissue
7Cited by
10References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 27, 1990 |
| Grant date | Jan 21, 1992 |
| Priority date | — |
| Expiry date | Dec 27, 2010 |
Classification
- Technology area (CPC —)General
Abstract
This invention relates to an improved method for electroplating a layer of nickel into titanium base alloy substrates. It is particularly useful in electroplating a layer of nickel onto titanium alloys which contain refractory metal elements, such as the alloy Ti-8Al-1V-1Mo. The method includes the steps of etching the surface of the substrate with a solution containing hydrofluoric acid and hydrochloric acid, followed by electroplating the etched surface in a nickel sulfamate solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.