Hot melt adhesives containing poly(p-hydroxystyrene) homopolymers and copolymers and bonding methods, employing same
USRE34122E · kind E · reissue
3Cited by
27References
37Claims
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Key dates
| Filing date | Jul 27, 1990 |
| Grant date | Nov 10, 1992 |
| Priority date | — |
| Expiry date | Jul 27, 2010 |
Classification
- Technology area (CPC —)General
Abstract
A hot melt adhesive composition which is especially useful for bonding polyamide article to surfaces, particularly polyamide surfaces. The composition contains an ethylene-vinyl ester copolymer or a polyamide polymer, and additionally contains a poly(p-hydroxystyrene) homopolymer or a copolymer of poly(p-hydroxystyrene) with a C.sub.1 to C.sub.4 alkyl acrylate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.