Method for removing soldering flux with alkaline salts, an alkali metal silicate and anionic polymer
USRE35017E · kind E · reissue
0Cited by
32References
18Claims
0Family size
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Key dates
| Filing date | Jun 8, 1994 |
| Grant date | Aug 15, 1995 |
| Priority date | — |
| Expiry date | Jun 8, 2014 |
Classification
- Technology area (CPC —)General
Abstract
The present invention is directed to aqueous cleaning compositions such as for household use or for cleaning electronic circuit assemblies comprising alkaline salt, an alkali metal silicate to boost detersive action or to provide corrosion protection to the substrates which are cleaned and an anionic polymer which stabilizes the alkali metal silicate to prevent precipitation of the silicate from solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.