Semiconductor device and method of producing the same
USRE35496E · kind E · reissue
1Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 8, 1995 |
| Grant date | Apr 29, 1997 |
| Priority date | — |
| Expiry date | Sep 8, 2015 |
Classification
- Technology area (CPC —)General
Abstract
A semiconductor device of the present invention accommodates a large semiconductor chip in a downsized package without impairing its reliability. The semiconductor chip is bonded on a relatively small die pad. Common inner leads and a plurality of inner leads are disposed opposite and spaced from the semiconductor chip by a gap ranging from 0.1 mm to 0.4 mm and the gap between the semiconductor chip and the common inner leads and the plurality of inner leads is filled with a resin which forms pan of a resin package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.