Solventless compounding and coating of non-thermoplastic hydrocarbon elastomers
USRE36855E · kind E · reissue
9Cited by
17References
40Claims
0Family size
Assignee
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Key dates
| Filing date | Jul 21, 1998 |
| Grant date | Sep 5, 2000 |
| Priority date | — |
| Expiry date | Jul 21, 2018 |
Classification
- Technology area (CPC —)General
Abstract
A solvent-free hot melt process, for preparing a non-thermosettable, pressure-sensitive adhesive from a tackified non-thermoplastic hydrocarbon elastomer. The process employs a continuous compounding device that has a sequence of alternating conveying and processing zones. The processing zones masticate and mix materials in them. Non-thermoplastic elastomers having high molecular weight may be readily compounded into adhesives in the process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.