Method for controlling configuration of laser induced breakdown and ablation
USRE37585E1 · kind E1 · reissue
Assignee
Inventors
Key dates
| Filing date | Aug 4, 1999 |
| Grant date | Mar 19, 2002 |
| Priority date | — |
| Expiry date | Aug 4, 2019 |
Classification
- Technology area (CPC —)General
Abstract
In one aspect the invention provides a method for laser induced breakdown of a material with a pulsed laser beam where the material is characterized by a relationship of fluence breakdown threshold (Fth) versus laser beam pulse width (T) that exhibits an abrupt, rapid, and distinct change or at least a clearly detectable and distinct change in slope at a predetermined laser pulse width value. The method comprises generating a beam of laser pulses in which each pulse has a pulse width equal to or less than the predetermined laser pulse width value. The beam is focused to a point at or beneath the surface of a material where laser induced breakdown is desired.The beam may be used in combination with a mask in the beam path. The beam or mask may be moved in the x, y, and Z directions to produce desired features. The technique can produce features smaller than the spot size and Rayleigh range due to enhanced damage threshold accuracy in the short pulse regime.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.