Smart cards having thin die

USRE37637E1 · kind E1 · reissue

Assignee

• LUCENT TECHNOLOGIES INC. · US

Inventors

• Mark B. Clifton · Plainsboro, US
• Richard M. Flynn · Mahtomedi, US
• Fred W. Verdi · Lawrence, US

Key dates

• Filing date: Nov 3, 1999
• Grant date: Apr 9, 2002
• Expiry date: Nov 3, 2019

Classification

• Technology area (CPC —): General

Abstract

Thin semiconductor die, approximately 0.004 to 0.007 inches thick, are positioned substantially on the neutral plane of a smart card, the neutral plane defined as the plane of substantially no mechanical strain during flexure of the smart card, thereby providing smart cards having improved resistance to mechanical flexure, and/or smart cards having improved RF performance.