Manufacture of high precision electronic components with ultra-high purity liquids
USRE37972E1 · kind E1 · reissue
4Cited by
23References
7Claims
0Family size
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Key dates
| Filing date | Jun 2, 1999 |
| Grant date | Feb 4, 2003 |
| Priority date | — |
| Expiry date | Jun 2, 2019 |
Classification
- Technology area (CPC —)General
Abstract
Semiconductor wafers and other electronic parts which similarly require ultra-high purity manufacturing environments are treated with ultra-high purity liquid cleaning and etching agents prepared at the site of use from gaseous raw materials which have been purified to a level compatible with semiconductor manufacturing standards, combined when appropriate with ultra-pure water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.