Inverted board mounted electromechanical device
USRE38381E1 · kind E1 · reissue
Assignee
Inventor
Key dates
| Filing date | Apr 23, 2002 |
| Grant date | Jan 13, 2004 |
| Priority date | — |
| Expiry date | Apr 23, 2022 |
Classification
- Technology area (CPC —)General
Abstract
A new board mounted electromechanical device is provided that mounts to a relay substrate to form a low profile reed relay. The reed relay is electrically connected to the electrical contacts via a signal traces and additional electrical traces located on the same side of the relay substrate which connect to the relay's signal and shielding. Additional traces on both sides of the signal traces of the reed relay provide a co-planar wave guide to maintain the desired impedance of the signal path. The reed relay is mounted in an inverted manner into a cut-out in the main circuit board so that the other portion of the reed relay itself is sits within the cut-out in the main circuit board. As a result, the reed relay component is recessed below the surface of the main circuit board resulting in an overall low profile circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.