Wiring board construction and methods of making same
USRE38579E1 · kind E1 · reissue
0Cited by
8References
45Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 20, 2001 |
| Grant date | Sep 14, 2004 |
| Priority date | — |
| Expiry date | Dec 20, 2021 |
Classification
- Technology area (CPC —)General
Abstract
A wiring board construction includes at least one microvia disposed in a base substrate and includes a deep imprinted cup shaped recess in the top surface thereof. A conductor material is disposed within the recess, and has a portion disposed at the bottom thereof. A conductor disposed at a bottom surface of the substrate opposite to the conductor material bottom portion helps to complete an electrically conductor path through the substrate to help complete an electrically conductive path through the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.