Integrated cooling system
USRE40618E1 · kind E1 · reissue
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2005 |
| Grant date | Jan 6, 2009 |
| Priority date | — |
| Expiry date | Mar 4, 2025 |
Classification
- Technology area (CPC —)General
Abstract
Systems and methods are described for integrated cooling system. A method includes: circulating a liquid inside a flexible multi-layer tape; and transporting heat between a heat source that is coupled to the flexible multi-layer tape and a heat sink that is coupled to the flexible multi-layer tape. A method includes installing a flexible multi-layer tape in an electrical system, wherein the flexible multi-layer tape includes a top layer; an intermediate, layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, the intermediate layer defining a closed loop circuit for a circulating fluid. An apparatus includes a flexible multi-layer tape, including: a top layer; an intermediate layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, wherein the intermediate layer defines a closed loop circuit for a circulating fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.