Method of providing a hydrophobic layer and condenser microphone having such a layer
USRE40781E1 · kind E1 · reissue
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2006 |
| Grant date | Jun 23, 2009 |
| Priority date | — |
| Expiry date | Aug 10, 2026 |
Classification
- Technology area (CPC —)General
Abstract
A method of providing at least part of a diaphragm and at least a part of a back-plate of a condenser microphone with a hydrophobic layer so as to avoid stiction between said diaphragm and said back-plate. The layer is deposited via a number small of openings in the back-plate, the diaphragm and/or between the diaphragm and the back-plate. Provides a homogeneous and structured hydrophobic layer, even to small internal cavities of the microstructure. The layer may be deposited by a liquid phase or a vapor phase deposition method. The method may be applied naturally in continuation of the normal manufacturing process.Further, a MEMS condenser microphone is provided having such a hydrophobic layer. The static distance between the diaphragm and the back-plate of the microphone is smaller than 10 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.