Curable slurry for forming ceramic microstructures on a substrate using a mold
USRE40967E1 · kind E1 · reissue
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Key dates
| Filing date | Mar 29, 2006 |
| Grant date | Nov 10, 2009 |
| Priority date | — |
| Expiry date | Mar 29, 2026 |
Classification
- Technology area (CPC —)General
Abstract
A curable slurry for forming ceramic microstructures on a substrate using a mold. The slurry is a mixture of a ceramic powder, a fugitive binder, and a diluent. The ceramic powder has a low softening temperature in a range of about 400° C. to 600° C. and a coefficient of thermal expansion closely matched to that of the substrate. The fugitive binder is capable of radiation curing, electron beam curing, or thermal curing. The diluent promotes release properties with the mold after curing the binder or quick and complete burn out of the binder during debinding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.