Conformal thermal interface material for electronic components
USRE41576E1 · kind E1 · reissue
16Cited by
52References
6Claims
0Family size
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Key dates
| Filing date | Nov 16, 2000 |
| Grant date | Aug 24, 2010 |
| Priority date | — |
| Expiry date | Nov 16, 2020 |
Classification
- Technology area (CPC —)General
Abstract
A thermally-conductive interface for conductively cooling a heat-generating electronic component having an associated thermal dissipation member such as a heat sink. The interface is formed as a self-supporting layer of a thermally-conductive material which is form-stable at normal room temperature in a first phase and substantially conformable in a second phase to the interface surfaces of the electronic component and thermal dissipation member. The material has a transition temperature from the first phase to the second phase which is within the operating temperature range of the electronic component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.