Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof
USRE41722E1 · kind E1 · reissue
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2002 |
| Grant date | Sep 21, 2010 |
| Priority date | — |
| Expiry date | Mar 26, 2022 |
Classification
- Technology area (CPC —)General
Abstract
A semiconductor device comprising a semiconductor pellet mounted on a pellet mounting area of the main surface of a base substrate, in which first electrode pads arranged on the back of the base substrate are electrically connected to bonding pads arranged on the main surface of the semiconductor pellet. The base substrate is formed of a rigid substrate, and its first electrode pads are electrically connected to the second electrode pads arranged on its reverse side. The semiconductor pellet is mounted on the pellet mounting area of the main surface of the base substrate, with its main surface downward, and its bonding pads are connected electrically with the second electrode pads of the base substrate through bonding wires passing through slits formed in the base substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.