Photo-curable resin composition used for photo-fabrication of three-dimensional object
USRE42593E1 · kind E1 · reissue
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20References
17Claims
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Key dates
| Filing date | Sep 26, 2003 |
| Grant date | Aug 2, 2011 |
| Priority date | — |
| Expiry date | Sep 26, 2023 |
Classification
- Technology area (CPC —)General
Abstract
A photocurable resin composition suitable for photo-fabrication. The resin composition capable of being promptly cured by photo-irradiation, thereby reducing fabricating time and providing cured products having excellent mechanical strength and minimized shrinkage during curing to ensure high dimensional accuracy. The composition includes (A) an oxetane compound, (B) an epoxy compound, and (C) a cationic photo-initiator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.