Wafer transfer apparatus and substrate transfer apparatus
USRE47145E1 · kind E1 · reissue
Assignee
Inventor
Key dates
| Filing date | May 18, 2017 |
| Grant date | Nov 27, 2018 |
| Priority date | — |
| Expiry date | May 18, 2037 |
Classification
- Technology area (CPC —)General
Abstract
A wafer transfer apparatus is provided. In a minimum transformed state where a robot arm is transformed such that a distance defined from a pivot axis to an arm portion, which is farthest in a radial direction relative to the pivot axis, is minimum, a minimum rotation radius R, is set to exceed ½ of a length B in the forward and backward directions of an interface space, the length B corresponding to a length between the front wall and the rear wall of the interface space forming portion, and is further set to be equal to or less than a subtracted value obtained by subtracting a distance L0 in the forward and backward directions from the rear wall of the interface space forming portion to the pivot axis, from the length B in the forward and backward directions of the interface space (i.e., B/2<R≤B−L0).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.