Semiconductor device and method for manufacturing the same
USRE47988E1 · kind E1 · reissue
1Cited by
6References
28Claims
0Family size
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Key dates
| Filing date | May 28, 2018 |
| Grant date | May 12, 2020 |
| Priority date | — |
| Expiry date | May 28, 2038 |
Classification
- Technology area (CPC —)General
Abstract
A semiconductor device comprises a memory cell region, a peripheral circuit region and a boundary region. In the memory cell region, a concave lower electrode and a foundation layer have a same uppermost surface positioned in a height of H above the plane-A. In the boundary region, one concave lower conductive region and a foundation layer have a same uppermost surface positioned in a height of H above the plane-A.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.