Interconnect devices for electronic packaging assemblies

USRE48015E1 · kind E1 · reissue

Assignee

• General Electric Company · US

Inventors

• Gamal Refai-Ahmed · Markham, CA
• David Mulford Shaddock · Troy, US
• Arun Virupaksha Gowda · Rexford, US
• John Anthony Vogel · Charlton, US
• Christian M. Giovanniello · Clifton Park, US

Key dates

• Filing date: Feb 1, 2018
• Grant date: May 26, 2020
• Expiry date: Feb 1, 2038

Classification

• Technology area (CPC —): General

Abstract

An electronic packaging assembly having a semiconductor integrated circuit and a plurality of interconnect components is provided. The plurality of interconnect components is operatively coupled to the semiconductor integrated circuit. Further, one or more interconnect components include one or more support elements having a first surface and a second surface, and one or more spring elements having a first end and a second end, and wherein first ends of the one or more spring elements are coupled to the first surface or the second surface of a respective support element.