ADVANCED SYSTEMS AUTOMATION LTD.
8Patents
2Active
8Granted
33Portfolio score
Filing activity: Jun 19, 1997 → Jul 29, 2014 · 1 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6576867B1 | Method and apparatus for removal of mold flash | Electricity | 17 | Expired |
| US5989471A | BGA mould assembly for encapsulating BGA substrates of varying thickness | Performing Operations; Transporting | 16 | Expired |
| US6030569A | Packaging process using a wedge device for linear force amplification in a press | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6013541A | Method and apparatus for reducing warpage in semiconductor packages | Electricity | 10 | Expired |
| US6137286A | Test handler | Physics | 6 | Expired |
| US7692440B2 | Handler for semiconductor singulation and method therefor | Emerging Cross-Sectional Technologies | 2 | Expired |
| US9524885B2 | Apparatus for molding a semiconductor wafer and process therefor | Electricity | 0 | Active |
| US8791583B2 | Apparatus for molding a semiconductor wafer and process therefor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.