Method and apparatus for reducing warpage in semiconductor packages
US6013541A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 19, 1997 |
| Grant date | Jan 11, 2000 |
| Priority date | — |
| Expiry date | Jun 19, 2017 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48247
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for reducing warpage in semiconductor packages, and in particular, thin quad flat packages (TQFPs). The apparatus includes a clamping jig having a bottom plate and an upper plate. The bottom plate is connected to a heater which heats the plate to approximately 50 to 70 degrees Celsius. An air supply controller delivers air supply to the upper plate. The TQFPs are placed in between the bottom plate and the upper plate immediately after they have been encapsulated with resin and the resin has cured. The clamping jig clamps the TQFPs in between the bottom and upper plate with a slight force. The TQFPs remain in the clamping jig until they have sufficiently cooled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.