Archcom Technology, Inc.
1Patents
0Active
1Granted
20Portfolio score
Filing activity: May 15, 2003 → May 15, 2003
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6846113B2 | Packaging for high power pump laser modules | Physics | 6 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.