Packaging for high power pump laser modules
US6846113B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 15, 2003 |
| Grant date | Jan 25, 2005 |
| Priority date | — |
| Expiry date | May 15, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4238
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Locally heated low temperature solder glass is used to permanently fix an optical fiber with sub-micron precision to a glass ceramic submount inside a high power pump laser module. The fiber is manipulated into a predetermined alignment while the solder glass is still molten and the solder glass is then cooled to its solidified state. The predetermined alignment may include an offset to compensate for subsequent thermally related dimensional changes as the solder glass cools and solidifies. If necessary, the solder glass can be remelted and the fiber realigned with a different offset if the first alignment attempt is less than optimal. This alignment process has been demonstrated to provide reliable and efficient coupling of an optical fiber to a high power pump laser within very tight tolerances. A similar process can also be applied to other micro-optics assemblies where high precision, high reliability fiber fixing is required.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.