Patent assignee · US · COMPANY

Dynamic Details, Inc.

2Patents
2Active
2Granted
40Portfolio score

Filing activity: Feb 14, 2007 → Mar 17, 2009 · 2 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US7523545B2 Methods of manufacturing printed circuit boards with stacked micro vias Emerging Cross-Sectional Technologies 9 Active
US7856706B2 Methods of manufacturing printed circuit boards with stacked micro vias Emerging Cross-Sectional Technologies 3 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.