Dynatex International
4Patents
0Active
4Granted
26Portfolio score
Filing activity: Dec 16, 1994 → Aug 26, 2005
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5820006A | Apparatus for scribing and/or breaking semiconductor wafers | Emerging Cross-Sectional Technologies | 34 | Expired |
| US7262115B2 | Method and apparatus for breaking semiconductor wafers | Emerging Cross-Sectional Technologies | 6 | Expired |
| US5702492A | Semiconductor wafer hubbed saw blade and process for manufacture of semiconductor wafer hubbed saw blade | Performing Operations; Transporting | 4 | Expired |
| US5588419A | Semiconductor wafer hubbed saw blade | Performing Operations; Transporting | 3 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.