Method and apparatus for breaking semiconductor wafers
US7262115B2 · kind B2 · utility
6Cited by
15References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2005 |
| Grant date | Aug 28, 2007 |
| Priority date | — |
| Expiry date | Mar 11, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/325
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An apparatus and method for breaking a semiconductor wafer along scribe lines to separate individual die. A scribe line of the wafer is aligned with a straight, elongated pyramid-shaped edge of a precision bending bar, and a compressive force is applied to the surface of the wafer by a compressive member to bend the wafer over the edge and break the wafer along the scribe line.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.