Hitachi Material Engineering, Ltd.
1Patents
0Active
1Granted
24Portfolio score
Filing activity: Feb 20, 1992 → Feb 20, 1992
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5325012A | Bonded type piezoelectric apparatus, method for manufacturing the same and bonded type piezoelectric element | Electricity | 58 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.