Bonded type piezoelectric apparatus, method for manufacturing the same and bonded type piezoelectric element
US5325012A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Feb 20, 1992 |
| Grant date | Jun 28, 1994 |
| Priority date | — |
| Expiry date | Feb 20, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/073
Abstract
The features of the present invention are 1) to apply metallization on the bonding surface of a piezoelectric ceramic with a metal likely to react with the piezoelectric ceramic material, 2) when the piezoelectric ceramic material is soldered on the bonding surface, to apply metallization with a metal likely to react with the solder material, 3) to provide between the metallizing layers formed in 1) and 2) a metallizing layer including metal which prevents reaction between the metals and their diffusion, 4) to use a mounting member for the piezoelectric ceramic which has substantially the same thermal expansion coefficient as the piezoelectric ceramic in non-polarization condition and 5) to solder in the non-polarization condition and thereafter to polarize. As the result, a bonded type piezoelectric apparatus with a high reliability or with a broad application temperature range near from the absolute zero temperature to the Curie point of the piezoelectric element, and a method of manufacturing the same are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.