Interplex QLP, Inc.
4Patents
4Active
4Granted
45Portfolio score
Filing activity: Aug 18, 2004 → Nov 19, 2010 · 4 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7803307B2 | Ultra high-temperature plastic package and method of manufacture | Electricity | 11 | Active |
| US7679185B2 | Microcircuit package having ductile layer | Electricity | 5 | Active |
| US7736573B2 | Thermoplastic material | Emerging Cross-Sectional Technologies | 2 | Active |
| US8039945B2 | Plastic electronic component package | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.