IQLP LLC
2Patents
2Active
2Granted
37Portfolio score
Filing activity: Apr 14, 2010 → Jan 12, 2012
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8728606B2 | Thermoplastic material | Emerging Cross-Sectional Technologies | 0 | Active |
| USRE43807E1 | Microcircuit package having ductile layer | General | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.