Patent assignee · JP · COMPANY

Kidd, Inc.

1Patents
0Active
1Granted
22Portfolio score

Filing activity: Dec 5, 1984 → Dec 5, 1984

Most-cited patents

PatentTitleAreaCited byStatus
US4574056A Die-bonding electroconductive paste Emerging Cross-Sectional Technologies 12 Expired

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.