Die-bonding electroconductive paste
US4574056A · kind A · utility
12Cited by
3References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 5, 1984 |
| Grant date | Mar 4, 1986 |
| Priority date | — |
| Expiry date | Dec 5, 2004 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A die-bonding electroconductive paste containing at least one element having the same valence as the valence of a semiconductor element to be die-bonded or a compound of said element and a reducing substance and permitting ohmic contact to be effected at a temperature of not less than 100.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.