Machine Active Contact Co., Ltd.
3Patents
0Active
3Granted
24Portfolio score
Filing activity: Oct 9, 1996 → Aug 7, 2000
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6239983A | Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board | Emerging Cross-Sectional Technologies | 32 | Expired |
| US5886877A | Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board | Emerging Cross-Sectional Technologies | 29 | Expired |
| US6350957B1 | Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board | Emerging Cross-Sectional Technologies | 17 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.