Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
US5886877A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Oct 9, 1996 |
| Grant date | Mar 23, 1999 |
| Priority date | — |
| Expiry date | Oct 9, 2016 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit board, which is formed with bump patterns subject to a narrow variation in height on the surface of the circuit board, and which permits high-density packaging of a semiconductor component thereon. In this circuit board, conductor circuits formed by electroplating are embedded in an insulating base that is formed of a resist layer and an insulating substrate, and bumps are exposed in the surface of the insulating base. The bumps and the conductor circuits are connected electrically with one another by means of pillar-shaped conductors that are formed by electroplating. Each bump is a multilayer structure in two or more layers formed by successively depositing different electrically conductive materials by electroplating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.