Metalbond Technologies, LLC
1Patents
0Active
1Granted
22Portfolio score
Filing activity: Apr 11, 2001 → Apr 11, 2001
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6875318B1 | Method for leveling and coating a substrate and an article formed thereby | Chemistry; Metallurgy | 6 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.