Method for leveling and coating a substrate and an article formed thereby
US6875318B1 · kind B1 · utility
6Cited by
51References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2001 |
| Grant date | Apr 5, 2005 |
| Priority date | — |
| Expiry date | Apr 11, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/024
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method for providing a level surface onto which a metallic coating may be applied is provided. Articles formed using the method are also provided. The method involves leveling the surface of a substrate by applying an electrophoresis polymeric coating followed by a physical vapor deposition of a metallic coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.