Microlithics Corporation
2Patents
0Active
2Granted
24Portfolio score
Filing activity: Oct 6, 1988 → Sep 15, 1989
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5108785A | Via formation method for multilayer interconnect board | Electricity | 50 | Expired |
| US5073840A | Circuit board with coated metal support structure and method for making same | Electricity | 28 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.