Circuit board with coated metal support structure and method for making same
US5073840A · kind A · utility
28Cited by
24References
69Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 6, 1988 |
| Grant date | Dec 17, 1991 |
| Priority date | — |
| Expiry date | Oct 6, 2008 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09554
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board is provided having an electrically conductive substrate. Preferably, the electrically conductive substrate comprises molybdenum and copper. The substrate is selectively coated with a dielectric material which is capable of withstanding volatilization at high temperatures. The coefficient of thermal expansion of the substrate is substantially equal to that of the circuitry components which are placed thereon. A method of providing such a support structure is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.