PUREON INC.
1Patents
1Active
1Granted
38Portfolio score
Filing activity: Jan 30, 2020 → Jan 30, 2020
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11227772B2 | Multi-modal diamond abrasive package or slurry for polishing hard substrates | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.