Multi-modal diamond abrasive package or slurry for polishing hard substrates

US11227772B2 · kind B2 · utility

Assignee

• PUREON INC. · US

Inventors

• Terry Michael Knight · Chandler, US
• William R. Gemmill · Bethlehem, US
• Keith Harris Joye · Matthews, US
• Tony Russell Martin · Huddersfield, GB

Key dates

• Filing date: Jan 30, 2020
• Grant date: Jan 18, 2022
• Expiry date: Jan 30, 2040

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/02013
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A multi-modal diamond abrasive package or slurry is disclosed for polishing hard substrates. The multi-modal diamond abrasive package or slurry generally includes a plurality of diamond abrasives. Each one of the diamond abrasives of the plurality of diamond abrasives has a particle size. Wherein, the multi-modal diamond abrasive package or slurry includes a first diamond abrasive and a second diamond abrasive. The first diamond abrasive has a first particle size, and the second diamond abrasive has a second particle size. Where, the first particle size of the first diamond abrasive is smaller than the second particle size of the second diamond abrasive.