Remtec, Inc.
1Patents
0Active
1Granted
23Portfolio score
Filing activity: Apr 7, 1993 → Apr 7, 1993
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5298687A | High-density multilayer interconnection system on a ceramic substrate for high current applications and method of manufacture | Emerging Cross-Sectional Technologies | 30 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.