High-density multilayer interconnection system on a ceramic substrate for high current applications and method of manufacture
US5298687A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 1993 |
| Grant date | Mar 29, 1994 |
| Priority date | — |
| Expiry date | Apr 7, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49128
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
High density/heavy current hybrid circuit on a ceramic substrate, or other insulating board material, includes first screen printed silver, or copper, polymer seed layer for basic circuitry and bus bar around this circuitry outside the scribe lines, which is connected by removable silver filled polymer links with the circuitry and also the circuit elements are connected with each other by the same links in order to provide uniform electroplating. The links are protected before electroplating with a removable plating resist and they are removed after electroplating using an appropriate stripping solution. Then a permanent plating resist and dielectric polymer thick film isolation layer are applied (for crossovers) on which the second seed layer is applied, plating of the second metal layer occurs and so on until the desired number of layers are done. Thus, cure temperature is that of polymerization, high density, good heat dissipation conditions, heavy current capacity in all the layers and low manufacturing costs are achieved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.