Shoshotech Co., Ltd.
2Patents
0Active
2Granted
26Portfolio score
Filing activity: May 15, 1998 → Jun 1, 1999
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6351885B2 | Method of making conductive bump on wiring board | Emerging Cross-Sectional Technologies | 66 | Expired |
| US6217343A | Multipoint conductive sheet | Electricity | 25 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.