Method of making conductive bump on wiring board
US6351885B2 · kind B2 · utility
66Cited by
12References
3Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 15, 1998 |
| Grant date | Mar 5, 2002 |
| Priority date | — |
| Expiry date | May 15, 2018 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49208
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring board structure has an insulating base having at least one projection located thereon, wherein the insulating base and the at least one projection are integrally formed from a same piece of insulating material. The wiring board structure also has at least one lead located on the insulating base, wherein a part of the at least one lead covers the at least one projection to form at least one conductive bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.