Spheretek, LLC
2Patents
0Active
2Granted
22Portfolio score
Filing activity: Mar 22, 1999 → Sep 24, 2001
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6293456A | Methods for forming solder balls on substrates | Electricity | 23 | Expired |
| US6609652B2 | Ball bumping substrates, particuarly wafers | Electricity | 13 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.