Substrate Technologies Incorporated
5Patents
0Active
5Granted
25Portfolio score
Filing activity: May 8, 1998 → Jan 18, 2001
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6107683A | Sequentially built integrated circuit package | Electricity | 64 | Expired |
| US6300165A | Ball grid substrate for lead-on-chip semiconductor package | Electricity | 44 | Expired |
| US6534861B1 | Ball grid substrate for lead-on-chip semiconductor package | Electricity | 28 | Expired |
| US6248612A | Method for making a substrate for an integrated circuit package | Electricity | 9 | Expired |
| US6501168B1 | Substrate for an integrated circuit package | Electricity | 8 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.