WSTP, LLC
5Patents
5Active
5Granted
44Portfolio score
Filing activity: Mar 7, 2006 → Dec 16, 2009 · 5 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7604153B2 | Forming solder balls on substrates | Electricity | 7 | Active |
| US7837083B2 | Forming solder balls on substrates | Electricity | 4 | Active |
| US7654432B2 | Forming solder balls on substrates | Electricity | 4 | Active |
| US7819301B2 | Bumping electronic components using transfer substrates | Electricity | 1 | Active |
| US7842599B2 | Bumping electronic components using transfer substrates | Electricity | 1 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.